Introduction to Test Fundamentals 1

CourseIntroBig3

Lesson 1 – Introducing Automatic Testing

This lesson covers the Semiconductor Manufacturing Process, various types of ATE, and the peripheral equipment used in high-volume manufacturing test.

Topics include:

  • Silicon, Die, Wafers
  • Wafer Saw, Die Attach, Assembly
  • Packaging, Package Types
  • Automatic Test Equipment (ATE)
  • Analog, Digital, Mixed Signal, Memory, SOC
  • Automatic Testing Process
  • Load boards, Pogo connectors, Sockets, Probe Cards
  • Wafer Probers, Thermal Chambers
  • Automatic Device Handlers, Binning

There are 31 individual screens in this section and a 10 question quiz.

This lesson is fully functional in the Course Demo.

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