Chip Testing Overview - Details

Course Length: 4 hours

Content
From start to finish each step in the production test process is covered, some additional topics included in the course are outlined below:

We begin with a brief overview using short movie clips:

• Growing the silicon and making base wafers
• Fabricating the circuits onto base wafers
• Wafer testing -first step in test process
• Sawing wafers into die, assembling die into packages
• Package test - second step of test
• Quality Assurance Testing
• Mark, Pack and Ship

Additional topics include:

• Common types of ATE test equipment
• Common circuits and design technologies
• Peripheral Equipment
• Device packages
• Type of tests performed
• What can be learned from testing
• What does testing insure
• Benefits of testing
• The cost of test
• Test philosophy
• General Q & A
• Summary

Prerequisites
None - although this seminar introduces many technical terms and concepts, it is designed as an entry-level course, a technical background is not required.

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