Microelectronics Failure Analysis

DVD 8

Lecture 22

"Focused Ion Beam (FIB) methods"
Presenter: Joe Michael 
Sandia Labs

In lecture 22 Joe explains the workings of Focused Ion Beam instrumentation. It's obvious that Joe has years of experience in this area and he supports his discussion with excellent pictures and graphs.

Topics:

• Typical FIB Configurations

• Theory of Liquid Metal Ion Source (LMIS) 

• Gas Injection Systems

• Ion- solid Interaction Monte Carlo Modeling

• FIB Micromachining

• Techniques for location of areas of interest

• Sulfide Corrosion Bloom

• Prethinned FIB Technique

• VCSEL Failure Analysis

Included with this lecture, you will receive 56 presentation slides in PDF format. Lecture time is approximately 75 minutes.

Click here for a biography of Joe Michael 

Click here for a sample video of the presentation in Windows Media format. Note: Size and Quality of this clip have been reduced for web use. 

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Lecture 23

"MEMS Failure Analysis I"
Presenter:Jerry Walraven 
Sandia Labs

Lecture 23 - Jerry explains the details of Microelectromechanical Systems (MEMS) technology. He discusses tools and techniques for MEMS failure analysis, and describes failure mechanisms observed in various MEMS technologies.

Topics:

• What are MEMS?

• MEMS Fabrication Technologies

• MEMS Application Technologies

• Future MEMS Applications

• Tools and techniques for MEMS FA 

• MEMS failure mechanisms

• MEMS Polymer & MEMS Sensors

• Chemical detection systems 

• Optical MEMS Actuators

• RF MEMS & Microfluidic MEMS 

• Electrostatic Drop Ejection

• BioMEMS

Included with this lecture, you will receive 34 presentation slides in PDF format. Lecture time is approximately 75 minutes.

Click here for a biography of Jerry Walraven 

Click here for a sample video of the presentation in Windows Media format. Note: Size and Quality of this clip have been reduced for web use. 

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Note: Sample Video Clips require Windows Media Player. If you do not have it, you can download it here for Free Click the Windows Icon to Begin downloading

Mac Users Click here

Lecture 24

"MEMS Failure Analysis II"
Presenter:Jerry Walraven 
Sandia Labs

In Lecture 24 Jerry explains that MEMS Failure Analysis activities fall into 3 separate categories: Structural, Chemical and Electrical. 

Topics:

• Structural analysis: Optical Microscopy

• Infrared (IR) thermal imaging

• Device repair using the FIB

• Scanning electron microscopy

• Atomic force microscopy

• Transmission Electron Microscopy (TEM)

• MEMS FA using Auger Spectroscopy

• Voltage contrast imaging

• Resistive contrast imaging (RCI)

• Stiction

• And much more with great photos

Included with this lecture, you will receive 42 presentation slides in PDF format. Lecture time is approximately 75 minutes.

Click here for a biography of Jerry Walraven 

Click here for a sample video of the presentation in Windows Media format. Note: Size and Quality of this clip have been reduced for web use. 

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Note: Sample Video Clips require Windows Media Player. If you do not have it, you can download it here for Free Click the Windows Icon to Begin downloading

Mac Users Click here

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