Microelectronics  Failure Analysis

DVD 2

Lecture 4

"Electron Microscopy"

Presenter:  Larry Wagner
Texas Instruments 
 

Lecture 4 addresses various methods and techniques of Microscopy. Then discusses the associated trade-offs. See the topics below.

Topics:

• Three Phases of Microscopy and Analysis

• SEM/Optical Comparisons

•  X-ray Detection Techniques

• Trade-offs in Microscopy

•   - Scanning Microscopy
    - Optical Microscopy
    - Polarized Imaging
    - Light Microscopy for Liquid Crystal
    - Fluorescence Microscopy
    - IR (Infrared) Microscopy
    - Confocal Microscopy

• UV Microscope

• SEM Radiation Sources 

• Astigmatism 

• And much more

Included with this lecture, you will receive 80 presentation slides in PDF format. Lecture time is approximately 75 minutes.

Click here for a biography of Larry Wagner

Click here for a sample video of the presentation in Windows Media format. Note: Size and Quality of this clip have been reduced for web use. 

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Lecture 5

"Fault Isolation Scanning Optical Microscopy"

Presenter: Ed Cole 
Sandia Labs

In Lecture 5 Ed explains Advanced Fault Isolation using a variety of tools and techniques.

Topics:

• Low Energy CIVA (LECIVA) 

• Confocal and OBIC Imaging

• New SOM techniques

• Light-Induced Voltage Alteration (LIVA)

• Thermally Induced Voltage Alteration (TIVA)

• Seebeck Effect Imaging (SEI)

• Surface Charging Phenomenon

• Capacitive Charge Generation (CCG)

• Optical Beam Induced Current (OBIC)

• Data Acquisition Considerations

• Backside Sample Preparation Considerations

Included with this lecture, you will receive 59 presentation slides in PDF format. Lecture time is approximately 75 minutes.

Click here for a biography of Ed Cole

Click here for a sample video of the presentation in Windows Media format. Note: Size and Quality of this clip have been reduced for web use. 

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Note: Sample Video Clips require Windows Media Player. If you do not have it, you can download it here for Free Click the Windows Icon to Begin downloading

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Lecture 6

"IC Packaging Technology & Analytical Methods"

Presenter: Tom Moore 
Omniprobe, Inc.

Lecture 6 focuses on device packaging FA. Tom explains in detail problems associated with device packages and methods of detection.

Topics:

• Package Characterization and Fault Isolation 

• Critical package defects

• Advanced package characterization techniques 

• Scanning Acoustic Microscopy (SAM)

• Real-time X-ray Radiography (RTX)

• Time Domain Reflectometry (TDR)

• Looking for gaps in the package characterization
  roadmap

Included with this lecture, you will receive 41 presentation slides in PDF format. Lecture time is approximately 75 minutes.

Click here for a biography of Tom Moore

Click here for a sample video of the presentation in Windows Media format. Note: Size and Quality of this clip have been reduced for web use. 

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Note: Sample Video Clips require Windows Media Player. If you do not have it, you can download it here for Free Click the Windows Icon to Begin downloading

Mac Users Click here

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